The Indium-Enhanced Sn-58Bi lead-free solder offers a low-temperature, high-reliability solution for modern electronic packaging. Indium improves wettability, ductility, and reliability, overcoming the brittleness of Sn-58Bi. Its low melting point reduces thermal stress, ideal for 3D SiP assemblies. This eco-friendly solder forms strong, void-free joints with lower energy use, enabling sustainable, high-density electronic interconnects.